ESD7C3.3DT5G【PDF 1/4 页】DIODE ESD PROT 3.3V SOT-723

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Sheet目录224

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ESD7C, SZESD7C SERIES

Transient Voltage

Suppressors

Micro ? Packaged Diodes for ESD Protection

The ESD7CxxD Series is designed to protect voltage sensitive

components from ESD. Excellent clamping capability, low leakage, and

fast response time make these parts ideal for ESD protection on designs

where board space is at a premium. Because of its small size, it is suited

for use in cellular phones, portable devices, digital cameras, power

supplies and many other portable applications.

Specification Features:

? Low Capacitance 6.2 pF to 13 pF

? Low Clamping Voltage

? Small Body Outline Dimensions:

0.047 ″ x 0.047 ″ (1.20 mm x 1.20 mm)

? Low Body Height: 0.020 ″ (0.5 mm)

? Stand ? off Voltage: 3.3 V, 5 V

? Low Leakage

? Response Time < 1 ns

? ESD Rating of Class 3 (> 16 kV) per Human Body Model

? IEC61000 ? 4 ? 2 Level 4 ESD Protection

? SZ Prefix for Automotive and Other Applications Requiring Unique

Site and Control Change Requirements; AEC ? Q101 Qualified and

PPAP Capable

? These are Pb ? Free Devices

Mechanical Characteristics:

http://onsemi.com

PIN 1. CATHODE 1

2. CATHODE 3

3. ANODE 2

MARKING

DIAGRAM

L5 M

SOT ? 723

CASE 631AA

L5 = Specific Device Code

M = Date Code

*Date Code orientation and/or position may

vary depending upon manufacturing location.

ORDERING INFORMATION

Device Package Shipping ?

CASE: Void-free, transfer-molded, thermosetting plastic

Epoxy Meets UL 94 V ? 0

ESD7CxxDT5G

SOT ? 723

(Pb ? Free)

8000 /

Tape & Reel

LEAD FINISH: 100% Matte Sn (Tin)

MOUNTING POSITION: Any

QUALIFIED MAX REFLOW TEMPERATURE: 260 ° C

Device Meets MSL 1 Requirements

MAXIMUM RATINGS

SZESD7CxxDT5G SOT ? 723 8000 /

(Pb ? Free) Tape & Reel

?For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

Rating

Symbol

Value

Unit

IEC 61000 ? 4 ? 2 (ESD) Contact

Air

Total Power Dissipation on FR ? 5 Board

(Note 1) @ T A = 25 ° C

Derate above 25 ° C

Thermal Resistance Junction ? to ? Ambient

Junction and Storage Temperature Range

Lead Solder Temperature ? Maximum

(10 Second Duration)

P D

R q JA

T J , T stg

T L

± 8.0

± 15

240

1.9

525

? 55 to

+150

260

mW/ ° C

° C/W

° C

DEVICE MARKING INFORMATION

See specific marking information in the device marking

column of the table on page 2 of this data sheet.

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. FR ? 5 = 1.0 x 0.75 x 0.62 in.

See Application Note AND8308/D for further description of survivability specs.

? Semiconductor Components Industries, LLC, 2012

March, 2012 ? Rev. 3

Publication Order Number:

ESD7C3.3D/D

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